Automated Recycling Sorting (The Recyclone)
RIT team project (MCET‑550). The recycling industry spends billions each year sorting cans and bottles. We explored a smaller‑scale sorter intended for schools and businesses: a compact device that detects a bottle, classifies its material, and ejects it into the correct bin using a rack‑and‑pinion mechanism.
Summary
We followed the DMADV process to take the concept from customer requirements to a tested prototype, scoping for low‑cost deployment in offices and schools rather than industrial facilities. An Arduino Mega coordinated an ultrasonic sensor (presence) and inductive + capacitive sensors (material ID) to route aluminum, glass, and plastic into separate compartments. Each class triggered a stepper‑driven ejector on a rack‑and‑pinion mechanism.
What we did
- Captured VOC → CTQs, built a House of Quality and Product Spec, and scoped the use case around 10‑gal cans for schools/offices.
- Explored mechanisms with a Pugh matrix; selected a triple‑ejector design with a single can divided into sections.
- Modeled the system in CAD, completed DFMEA/tolerance work, and assembled a working prototype.
- Implemented control logic on Arduino Mega and motor drivers to sequence sensors and steppers safely.
- Validated cycle time and detection accuracy, and documented wiring/safety standards for operation.
Results
- Average cycle time under ~1 second across materials (≈0.66–0.88 s measured).
- Material ID accuracy: plastic and glass 100% in tests; aluminum 80% with our inductive sensor setup.
My focus
- Developed the Arduino Mega firmware and sensor code (ultrasonic, inductive, capacitive) and integrated stepper control.
- Led team management for deliverables and meetings; maintained the schedule using our Gantt chart and milestone checkpoints.
- Mechanical concept & CAD for the rack‑and‑pinion ejectors and packaging.
- Fixture/geometry work to keep motion compact and repeatable.
- Test planning and analysis to quantify cycle time, accuracy, and failure modes; proposed upgrades (stiffer rack material, cleaner wiring/thermal management).